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Cyber Security Hardware Chips and Testing

时间:[2016-10-20]    作者:  浏览:

题目Cyber Security Hardware Chips and Testing

主讲:Bruce Kim教授

时间:1021日(周五)14:00-15:30

地点:信息楼B201

主办:国际合作与交流处、计算机工程学院

Bruce Kim教授简介

Dr. Bruce Kim is a Professor at the City University of New York. He provides undergraduate and graduate level education and performs research in various areas of microelectronics. He is a fellow of IMAPS and a recipient of the 1997 National Science Foundation CAREER award. He has performed research in MEMS, nanotechnology, nanosensors, microelectronics packaging, biomedical devices, System-on-Chip, RFIC and mixed-signal IC chips. He has brought over $12 million of research funding as PI or Co-PI from various funding agencies. He has published over 200 papers as book chapters, refereed journals and conferences. He has served as consultants and expert witness for six highly ranked law firms and companies. He has served as associate editor for IEEE Design and Test of Computers, Journal of Testing Technology, IEEE Transactions of Advanced Components, and IMAPS Journal of Microelectronics. He is a current member on board of governors for the IEEE CPMT Society.


报告主要内容:

 1、MEMS Package Testing

  1. Type of MEMS

  2. MEMS Testing Examples

  2、Testing of Through-Silicon-Via(TSV)

  1. What is TSV?

  2. Testing Philosophy of TSV Packages

  3. Modeling of TSV

 3、Characterization of Passives

  1. What are Integrated Passives?

  2. Spiral Inductor Characterization

  3. Testing of Integrated Passives

     

 

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